5G Technologies from Holitech
As the 5G network expands for commercial, industrial, IoT and in-vehicle applications, industry demand for new 5G materials and technologies is increasing. The increase in 5G communication transmission rate and signal strength requires that the PCBs used must have good transmission and heat dissipation performance, which necessitates the use of base materials with higher dielectric properties. Holitech's high-frequency and high-speed substrates have low dielectric loss and stable dielectric constant, and increase the signal transmission speed of intelligent terminals, reduce signal delay, and reduce signal loss.
Holitech's AH30000 series is a ceramic-filled PTFE substrate with very low dielectric loss and high stable dielectric constant. It is suitable for applications in complex environments and stringent reliability requirements such as millimeter-wave automotive and aerospace radar.
Holitech's AH21000 series is a hydrocarbon ceramic laminate material with ultra-low dielectric loss and high more stable dielectric constant. It is compatible with traditional FR4 processing technology and suitable for 5G base stations, 24GHz millimeter wave radar, in industrial control, smart transportation and smart medical.
5G not only brings new challenges and development opportunities for base materials, but also drives innovation in antenna technology. Due to the characteristics of 5G, the signal frequency of terminal antennas such as those in smartphones is constantly increasing. To ensure reliability and reduce signal loss during transmission, 5G communication has more indicators of dielectric constant and dielectric loss factor of antenna material.
Currently, cell phone antennas in 4G applications mainly use PI substrates. However, due to the large water absorption rate of PI substrates, the dielectric constant and dielectric loss factor are also large, especially for products with operating frequencies above 10 GHz, and therefore not suitable for applications in the 5G environment. Antennas in cell phones require the use of new antenna materials such as liquid crystal polymers (LCP) and also new manufacturing processes. Holitech specializes in the mass production of flexible LCP multilayer antennas and feeders. They are based on polymer co-sintering (HTCP) technology to achieve high multilayer structure and complex inner layer interconnection. The advantages are high integration with small footprint and excellent RF performance. They are suitable for consumer electronics terminals and smart wearables.